Line Type COG Bonder CL2000FW
Features
- Compact design, drastically saving floor space.
- Uniquely rigid head, achieving high bonding accuracy of ±5 µm.
- Automatic tuning function, contributing to shortened teaching time.
- Profile controlling is possible for both pre-bonding and main bonding heads.
- Simple change-over work, making the system compatible with panels from small sizes (e.g. 1 inch)to large sizes (max.12 inches).
Specifications
| Substrate size [mm] | Two panel conveyance | 20L × 20W-165L × 120Ｗ |
|---|---|---|
| One panel conveyance | 20L × 20W-275L × 165Ｗ ｔ＝0.4 × 2-1.1 × 2 | |
| Substrate types | Glass (LCD) | |
| Chip size [mm] *1 | 4L × 1W × 0.4t-20L × 5W × 0.8t | |
| Number of chip types | 2 | |
| Chip orientation | Face up / Face down | |
| Cycle time *2 | 4.5 [sec/chip] | |
| Alignment accuracy (3σ) *3 | ±2.5 [µm] (X,Y) | |
| Bonding accuracy (3σ) *3 | ±5 [µm] (X,Y) | |
| Bonding force [N] *4 | ACF lamination : 9.8-147 | |
| Pre-bonding : 19.6-196 | ||
| Main bonding : 19.6-294 | ||
| Heated tool temperature [°C] | ACF lamination : RT-150 Constant heater | |
| Pre-bonding : RT-350 Ceramic heater | ||
| Main bonding : RT-350 Ceramic heater | ||
| Power | 3-phase, AC200V ±10%, 50/60Hz±1Hz or 3-phase, AC220V ±10%, 50/60Hz ±1Hz, 15kVA | |
| Air pressure [MPa] | Dry air 0.49 | |
| Vacuum [kPa] | -80 | |
| Equipment dimensions [mm] | Approx. 3790W × 1800D × 2050H | |
| Weight [kg] | Approx. 3300 | |
Notes
*1 Longer chips (Max.28L) can be processed with an optional heated tool.
*2 Cycle time varies depending on processing conditions.
*3 Accuracy measurement is conducted using Toray-standard substrates.
Line Construction
Options
- Load cell
- Vacuum pump
- Ionizer
- Top cover
- HEPA filter
- Multiple heads for main bonding unit
- Edge cleaning unit
- Atmospheric plasma cleaning unit
