3-D Non-Contact Surface Profiler SP-700/500 Series
Overview
Precise 3-D measurement with optional interferometry
The SP−700/500 areal surface profiling system uses nano-level, non-contact measurement to provide 3-D detailed profiling of measuring object such as semiconductors, films, optics, and FPD substrates. In addition to 2- and 3-D display,it also enables calculation of various roughness parameters.
Measurement of thin films of more than 50 nm
The high-end SP-700 features an innovative algorithm for the measurement of transparent films. This algorithm allows simultaneous measurement of the profiles of the front and back surface and the thickness distribution of a sample covered with transparent film. Further improvements to the functionality of this transparent film measurement have led to the creation of an advanced algorithm for thin films. This development makes it possible to measure films of more than 50 nm.
Features
- High-precision
Height display resolution: 0.01 nm (min.) - High scanning speed
Vertical scanning speed: 214 µm/sec (max.) - High measurement speed
Full areal surface measurement with 2-D camera: Several sec/area - Wide Height measurement range
Vertical scanning range = 100 µm (max.) - Wide view size
Adjustable field of view: 5.9 × 4.5 mm (max.) - Transparent film profiling function (SP-700)
Profile and thickness distribution measurement of sample covered with transparent film: Film thickness 50 nm (min.) - Large selection of options
Bump inspection function, etc. - Wide variety of customizations
Customization of specifications for individual client needs
Specifications
| Model | SP−700, SP−500 |
|---|---|
| Measurement principle | White light interferometry (VSI : Vertical scanning interferometry, PSI : Phase shift interferometry) |
| Signal processing algorithm | SB algorithm (invented jointly by Tokyo Institute of Technology and Toray Engineering) |
| Measurable items | · Semiconductor wafers · Magnetic heads · FPD substrate · Film · MEMS · Optical parts · Fine patterning parts |
| Measurable and displayable items | (1) On-screen height (2) 2D profile (3) Surface roughness parameters (e.g., Rq, Ra) |
| Height measurement reproducibility | Depends on surface form and profiling conditions (e.g., magnification). Sample measurements: Measurement of steps using vertical scanning: σ (average) = 5 nm Measurement of steps using phase shift method: σ (average) = 0.1 nm |
| Height measurement range | 0-100 µm (400 µm option available) |
| Height display unit | 1 nm or 0.01 nm (switchable) |
| Measurement field of view | Can be adjusted by combining object lens and intermediate lens Minimum field of view: 0.08 mm × 0.07 mm Maximum field: Approx. 7 mm × 5 mm (see appendix) (approx. 30 mmΦ with wide field model) |
| Vertical scanning speed | Variable; maximum 214 µm/sec |
| Horizontal resolution | Variable; maximum 512 × 480 pixels (maximum 1376 × 1040 pixels with high-definition camera) |
| Measurement area selection | Possible; position and size selectable within screen shot (must be rectangular; up to 256 objects) |
| Measurement time | Depends on measurement range, horizontal resolution and measurement precision. Example: Height measurement range: 25 µm at 128 × 120 pixels. Standard model: Approx. 0.8 seconds |
| Interface language | Japanese (English option available) |
| Computer operating system | Windows 2000 |
| Standard features | · 3D display software (contour lines, bird’s-eye view, cross-section). · Displays profile between two chosen points. · Data storage (CSV, BMP, other file types). · Measures roughness and steps in multiple areas. · Data processing (filtering, reversal, tilt correction, curved surface correction). · Curvature measurement. |
| Device dimensions | Microscope: 300 mm(W) × 700 mm(D) × 500 mm(H) Computer rack: 700 mm(W) × 800 mm(D) × 1400 mm(H) |
| Power source | AC90−110V; 60Hz; 1KVA |
| Options | · Object lens (2.5 ×, 5 ×, 10 ×, 20 ×, 50 ×) · Intermediate lens (0.6 ×, 2.5 ×) · Vibration isolating table (desktop or floor) · 400 µm z-axis piezo mechanism (incl. controller) · Automatic XY stage · Step standards for use in correction · Transparent film measurement software (SP-700) · Bump measurement software · Magnetic head measurement software · Stitching software · SPView offline software · SPIP high-performance 3D image analysis software |
Specifications are subject to change due to product improvements
Object Lens, Measurement Field Size and Pixel Resolution
| Object lens | Standard camera | High-definition camera | Working distance (mm) |
Numerical aperture （NA） |
Notes | ||
|---|---|---|---|---|---|---|---|
| View size (mm) |
Pixel resolution (µm) |
View size (mm) |
Pixel resolution (µm) |
||||
| 2.5 × | 1.6 × 1.4 | 3.2 | 3.5 × 2.7 | 2.6 | 10.3 | 0.075 | Michaelson |
| 5 × | 0.80 × 0.72 | 1.6 | 1.8 × 1.3 | 1.3 | 9.3 | 0.13 | Michaelson |
| 10 × | 0.40 × 0.36 | 0.8 | 0.88 × 0.67 | 0.67 | 7.4 | 0.3 | Mirau |
| 20 × | 0.20 × 0.18 | 0.4 | 0.44 × 0.33 | 0.33 | 4.7 | 0.4 | Mirau |
| 50 × | 0.80 × 0.07 | 0.16 | 0.18 × 0.13 | 0.13 | 3.4 | 0.55 | Mirau |
NB: View size and pixel resolution listed can be changed by using an intermediate lens (0.6 ×, 2.5 ×).
Sample Measurements and Screenshots
Standard step (2D)
IC bump (2D)
IC bump (3D)
PDP substrate dividing wall (3D)
