Exhibit at “SEMICON China 2024”

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit at “SEMICON China 2024” held in Shanghai, China, from March 20 (Wed.) through March 22 (Fri.), 2024.

At the event, Toray Engineering will present variations of packaging equipment (flip chip bonders), laser trimming equipment, and the semiconductor inspection system INSPECTRA series, as inspection equipment for semiconductor manufacturing such as power semiconductors for automobiles.
We will also exhibit a panel introducing our unique integrated manufacturing technology for microLED displays, which are attracting attention as next-generation displays after LCDs and OLEDs.

Toray Engineering continues to contribute to society, offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.
Below are additional details about the exhibition.

Note

1. Exhibition name	:	SEMICON China 2024
2. Date	:	March 20 to 22
3. Venue	:	Shanghai New International Expo Centre, Shanghai, China
4. Official website	:	https://www.semiconchina.org/
5. Toray Engineering Booth	:	Hall N2　‐　N2820
6. Exhibition	:	Semiconductor packaging equipment (flip chip bonders) Laser trimming equipment Semiconductor Inspection System INSPECTRA Series MicroLED display manufacturing technology

Image of the company booth

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