Polyimide Etching
Using our patented, safe chemical agents, this is a revolutionary new method of polyimide film etching for new forms of semiconductor packages such as CSP and T-BGA.
Product List
Chemical Etching Technology for Polyimide Film and the Solution TPE3000
Polyimide film can be processed for blind-via or through-hole formation by chemical etching.
Product Overview
Chemical Etching Process
This process enables etching of a large number of via holes of different types on the same substrate, at a lower cost than laser processing.
Through-hole Sample
Film thickness: 25 microns
Hole size: 50 microns ~ a few hundred microns
Chemical Etching Sample
This process can form not only round holes, but also lattice-shaped holes which cannot be achieved with lasers. Applications include TAB, BGA and CSP.
