We provide FPC and COF manufacturing lines as complete systems.
- FPC, TAB and COF Lines
- Pitches are becoming ever finer in the world of semiconductor bonding. Toray Engineering's roll transfer processing systems have established an excellent reputation in the field of FPC and TAB. Our fine patterning technology is also at work in T-BGA and CSP.
- Polyimide Etching
- Using our patented, safe chemical agents, this is a revolutionary new method of polyimide film etching for new forms of semiconductor packages such as CSP and T-BGA.
- Organic Pattern Inspection System
- TB100/TB200 is possible to perform a very good inspection, which was difficult by the conventional method, on the multi layer printed substrate of very small size or the appearance inspection of the transparent electrode such as ITO or organic residue in LED production process.
Please use this form to request information or make an inquiry regarding Fine Patterning.
