Flip Chip Bonder (for Chip on Chip) FC2000X
Features
- With a chip loading unit and a substrateloading /unloading unit equipped as standard specification, the machine is also suitable for volume production.
- New image processing technology, high alignment accuracy of ±2 [µm] (3 sigma).
- Cycle time of 12 [sec](chip/substrate), fully-automatic operation.
- Off-line programming resulting in shortened change-over time.
- Unique ceramic heater, air slide bearing head, high-speed temperature profile and fine pressure control for various bonding conditions.
- Automatic tool change and leveling function by NC control, Multi-Chip-Module capability.
Specifications
| Substrate size [mm] | 2L × 2W-20L × 20W, t=0.1-1.6 |
|---|---|
| Substrate types | Si, GaAs, Glass Epoxy, FPC, Ceramics, etc. |
| Chip size [mm] | 0.2L × 0.2W-10L × 10W, t=0.05-1.0 |
| Number of chip types | 1-2 |
| Chip orientation | Face down or Face up |
| Cycle time *1 | 12 [sec/chip] |
| Alignment accuracy (3σ) *2 | ±2 [µm] (X, Y) |
| Bonding force [N] | Ultra-low pressure head : 0.049-9.8 |
| Heat tool temperature [°C] | RT-450 Ceramic heater (Thermo-compression) |
| Heated stage temperature [°C] | RT-450 Ceramic heater (Thermo-compression) |
| Power | 3-phase, AC200V ±10%, 50/60Hz ±1Hz or 3-phase, AC220V ±10%, 50/60Hz ±1Hz, 6kVA |
| Air pressure [MPa] | Dry air 0.49 |
| Vacuum [kPa] | -90 |
| Equipment dimensions [mm] | Approx. 1300W × 1300D × 2050H (subject to change) |
| Weight [kg] | Approx.1600 (subject to change) |
Notes
*1 Cycle time does not include processing time (i.e. loading, bonding and vacuum release).
*2 Accuracy measurement is conducted using Toray-standard substrates.
Optional items
- Air-Conditioning unit
- Ionizer
- Vacuum pump
- Automatic camera calibration
- Data logger
