Flip Chip Bonder (for SiP/COC/CSP) FC3000S
Features
- A semi-automatic machine, suited for conducting R&D work and small amount of production.
- High aligment accuracy of ±2µm is attainable, by moving search function and highly stiff frame structure.
- The system is exchangeable among Ultrasonic bonding process, Thermo-compression process and Solder process, by a simple change-over. (Head change-over time : about 15 minutes)
- It is possible to set a variety of temperature and pressure profiles, with the unique ceramic heater and pressure control method.
- Fine pitch and high precision interconnection is possible at relatively low temperatures for a package with multiple bumps, by the use of a unique DSS (Dual Support System) structure of its ultrasonic bonding head.
- A compact machine, contributing greatly to floor space saving.
Specifications
| Substrate size [mm] | Ceramic heater type | 3L × 3W-30L × 30W t=0.025-1.6 |
|---|---|---|
| Constant heater type | 30L × 30W-230L × 60W t=0.05-1.6 | |
| Substrate types | Glass Epoxy, FPC, Ceramics, etc. | |
| Chip size [mm] | Thermo-compression process *1 | 3L × 3W-20L × 20W t=0.05-1 |
| Ultrasonic bonding process *2 | 3L × 3W-15L × 15W t=0.3-0.8 | |
| Ultra low pressure bonding process | 3L × 3W-10L × 10W t=0.05-1 | |
| Number of chip types | 1-3 | |
| Chip orientation | Face down | |
| Cycle time *3 *4 | 6.0 [sec/chip] | |
| Alignment accuracy (3σ) *5 | ±2 [µm] (X, Y) | |
| Bounding force [N] | High-stiffness head | 9.8-490 |
| Ultra low pressure head | 0.049-9.8 | |
| Bonding head type | Ultrasonic head | 50kHz, 150W temperature RT, 100 [°C], 150 [°C], 180 [°C], 200 [°C] |
| Ceramic heater head | temperature RT-450 [°C] | |
| Power | 3-phase, AC200V ±10%, 50/60Hz ±1Hz or 3-phase, AC220V ±10%, 50/60Hz ±1Hz, 10kVA | |
| Air pressure [MPa] | Dry air 0.49 | |
| Vacuum [kPa] | -80 | |
| Equipment dimensions [mm] | Approx. 1030W × 1420D × 1880H (Height of signal light is included) | |
| Weight [kg] | Approx. 1500 | |
| Standard function | High-stiffness head　 | |
| Z-axis control　 | ||
| Automatic thermo-calibration　 | ||
| Automatic coplanarity adjustment | ||
Notes
*1 Slim chip (Min. 1.0 mm Wide) and large-sized chip (Max. 30.0 mm Long × 30.0mm Wide) can be processed with an optional heat tool.
*2 Slim chip (Min. 1.0 mm Wide) and long chip (Max.28.0 mm Long × 10.0 mm Wide) can be processed with an optional horn.
*3 The time required for setting substrate is not included.
*4 Cycle time does not include processing time (i.e. loading, bonding and vacuum release time).
*5 Accuracy measurement is taken using Toray-standard substrates.
Process
The system is exchangeable among ultrasonic bonding process, thermo-compression process and solder process, by a simple change-over.
Options
- Vacuum pump
- Ionizer
- N2 Purge
- Mounting monitoring system
