Bonder for Large-sized Substrates (Applications: Embedded Packaging etc.) MD3000/3500
Features
- Both face up and face down bonding types are available. (MD3000 : Face up, MD3500 : Face down) It is therefore optional, depending on applications.
- The bonder can be used for large-sized substrates with maximum size of 560 × 610mm.
- Absolute bonding table accuracy ±5µm on the bonding area is attainable, by the unique global alignment function.
- Burden of the operator is reduced, by the automatic tool parallelism adjustment.
Specifications
| MD3000 | MD3500 | |
|---|---|---|
| Substrate size [mm] | 250L × 250W-560L × 640W t=0.05-1 | |
| Substrate types | Glass, Epoxy, Cu foil, etc. | |
| Chip size [mm] | 0.8L × 0.8W-20L × 20W t=0.1-1 | |
| Number of chip types | 1-4 | |
| Chip bonding direction | Face up | Face down (Face up possible with an optional unit) |
| Chip orientation | Face up (Wafer 6", 8", 12" or Waffle Tray 2", 3", 4") | |
| Cycle time *1 | 2.4 [sec/chip] (Face up) | 2.0 [sec/chip] (Face Down) |
| 2.5 [sec/chip] (Face up : Option) | ||
| Alignment accuracy (3σ) *2 | ±5 [µm] (X, Y) | |
| Bonding force [N] | 0.49-49 | |
| Heat tool temperature [°C] | RT-80 Constant heater | RT-450 Ceramic heater |
| Stage temperature [°C] | RT-200 | |
| Power | 3-phase, AC200V ±10%, 50/60Hz ±1Hz or 3-phase, AC220V ±10%, 50/60Hz ±1Hz, 20kVA | |
| Air pressure [MPa] | Dry air 0.49 | |
| Vacuum [kPa] | -80 | |
| Equipment dimensions [mm] | Approx. 2960W × 1810D × 1890H | |
| Weight [kg] | Approx. 3000 | |
Notes
*1 Under the global alignment mode. Excluding processing time for loading, bonding, and vacuum release.
*2 Accuracy measurement is taken using Toray-standard substrates.
Process
Embedded Package ‐Chip Placement Method
MD3000
- Heat stage
- Head constant heater
- Face up bonding
MD3500
- Heat stage
- Head Ceramic heater
- Face down bonding
Options
- Wafer changer
- Vacuum pump
- Ionizer
- Wafer mapping
- Dispenser
- Face up unit (for MD3500)
