Super High Accuracy Flip Chip Bonder (for optical devices) OF2000
Features
- Highest alignment accuracy of ±0.5µm (3-sigma)
- "Unique Ceramic Heater Head" and "Fine Substrate Stage Leveling System", wide-range profile control is available.
- "Vibration-Proof" design and "Environment temperature auto-calibration software", stable productivity and durability are maintained.
- Fully automatic operation system equipped with loading & unloading of substrate and chip-loader from Gel pack or waffle pack.
- By adopting an "Air bearing" in the bonding head, excellent low pressure bonding operation is achieved.
Specifications
| Substrate size [mm] | 2L × 2W-20L × 20W |
|---|---|
| Chip dimensions [mm] | 0.2L × 0.2W-10L × 10W |
| Cycle time (*1) | 15 [sec/chip] + substrate handling 15 [sec] |
| Alignment accuracy (3σ) | ±0.5 [µm] (X,Y) ±0.2° (θ) *2 |
| Bonding force [N] | 0.049-9.8 |
| Heat tool temperature [°C] | RT-500 Ceramic heater |
| Heat stage temperature [°C] | RT-500 Ceramic heater |
| Power | 3-phase, AC200V ±10%, 50Hz/60Hz or 3-phase, AC220V ±10%, 50Hz/60Hz, 10kVA |
| Air pressure [MPa] | Dry air 0.49 |
| Vacuum [kPa] | －80 |
| Equipment dimensions [mm] | Approx. 2300W × 1500D × 1760H |
| Weight [kg] | Approx. 2000 |
Notes
*1 Does not include processing time (i.e. head touchdown, bonding and vacuum release).
*2 Distance between makes is 160µm
Options
- IR bonding inspection unit
- Measurement with IR transmission of the chip position to the substrate after bonding
- Auto-control parallel function for chip and substrate
- Active anti-vibration device
- Super high accuracy with shortest cycle time can be obtained by controlling vibration from source internal and external to the machine.
- Ｎ2 purge stage
- Data logger
- Ionizer
- Vacuum Pump
- Auto tool changer
New Approach for Optical Modules
Passive Alignment for LD Bonding
