Bonders
Toray Engineering has a complete line of flip chip bonders for a variety of applications, including CSP and other semiconductor packages, as well as optical devices, MEMS, COC and RFID.
Product List
Flip Chip Bonders
Flip Chip Bonder (for SiP/COC/CSP ) FC3000
Flip chip bonder which can be switched to either the thermo-compression process or ultrasonic bonding process with a change-over
Flip Chip Bonder (for SiP/COC/CSP) FC3000S
A semi-automatic machine, suited for conducting R&D work and small amount of production.
Bonder for Large-sized Substrates (Applications: Embedded Packaging etc.) MD3000/3500
Flip chip bonder ideal for embedded bonding
Super High Accuracy Flip Chip Bonder (for optical devices) OF2000
Super high accuracy flip chip bonder for optical devices, boasting bonding accuracy at the highest level in the world
Flip Chip Bonder (for MCM/COF/CSP) FC2000 series
Flip chip bonder which can be switched to either the thermo-compression process or ultrasonic bonding process with a change-over
Flip Chip Bonder (for Chip on Chip) FC2000X
With a chip loading unit and a substrateloading /unloading unit equipped as standard specification, the machine is also suitable for volume production.
Manual Type Flip Chip Bonder (for R&D Purpose) FC100M
Manual flip chip bonder ideal for R&D applications
Flip Chip Bonder for Surface Activated COC FC2000 (CoC)
Chip on chip bonder enabling surface activated room temperature bonding
RF-ID Manufacturing Equipment
Flip Chip Bonder (for RF-ID Tag) CF2000R
Flip Chip Bonder for RF-ID Tag, Compatible with IC cards and IC tags
