Flip Chip Bonder (for RF-ID Tag) CF2000R

Features

Multi-headed bonding structure and the latest unique image processing technology. This allows for packaging processes with a high productivity rate while still maintaining the highest accuracy.
Individual alignment mechanism for single chip and for single antenna. This assures stable and highly accurate packaging which is not affected by stretch of substrate.
Substantially reduced change-over time. This is irrespective of the multi-headed bounding structure.
Installation of pitch-variables mechanism. This enable matching with a diversity of design patterns for IC tags.
Unique transport system as applied to grip feeding and air dancer units. This makes the substrate stress-free.
Substrate-width variable mechanism. This enables one to choose among substrate materials.
Capability of packaging tiny chips. This contributes to manufacturing cost reduction of IC tags.

Application	RFID & Contactless smart card
Process	ACP, NCP
Substrate dimensions	Roll Width : 250-500mm, Thickness : 50-200µm, Web size :Φ500mm
Substrate materials	PET, PET-G, PI, etc
Chip dimensions	0.5 × 0.5-3.0 × 3.0mm, Thickness : 0.1-0.5mm
Chip supply & orientation	Wafer (Max. 8"). Chip tray (Face down)
Cycle time per chip	0.5sec (1.0sec in case of ±30µm alignment accuracy requirement)
Alignment accuracy	±50µm at 3σ
Heated tool temperature [°C]	RT-350 (Main bonding head)
Bonding force [N]	0.49-6.86
Power	3-phase, AC200V ±5%, 50Hz/60Hz or 3-phase, AC220V ±5%, 50Hz/60Hz, 30kVA
Air pressure [MPa]	Dry air 0.4-6.86
Vacuum [kPa]	-80
Equipment dimensions [mm]	Approx. 11,555W × 2,210D × 1,428H
Weight [kg]	Approx. 9,500