We at Toray Engineering offer optimal systems for a broad range of processes, including everything from inspection to testing.
- Inspection
- We have a full line-up of inspection systems for the semiconductor production process. All of these systems have earned an outstanding reputation on the production line for their high reliability, ease of operation and minimal running cost.
- Exposure
- We offer ID marking systems specially designed for wafers. These achieve marking in a compact area.
- Bonders
- Toray Engineering has a complete line of flip chip bonders for a variety of applications, including CSP and other semiconductor packages, as well as optical devices, MEMS, COC and RFID.
- Encapsulation
- These vacuum printing systems achieve voidless encapsulation and via-hole filling. We also offer vacuum printing systems for large substrates.
Please use this form to request information or make an inquiry regarding Semiconductors.
