Product line-up

Wafer Defect Inspection System INSPECTRA 1000EX-II

The 1000EX-II can now be used for an expanded range of processes. In addition to final defect inspection of back end processing wafers, it can now also be put to use in wafer front end processes (such as etching, lithography, CMP and CVD) that require high-speed inspections.

Wafer Pattern Inspection System INSPECTRA 7000R300

The Inspectra 7000R300 is a dedicated wafer front end process (e.g., etching, lithography, CMP, CVD) system, a state-of-the-art device that improves on the speed and sensitivity of the 1000EX-II series.

Wafer Edge Inspection System WE-1000

Performs automatic inspections of wafer edges to check for cracks, peeling and chipping.

3-D Non-Contact Surface Profiler for Wafers SP-500WA

The SP-500WA provides 3D profiling of bumps on wafers and IC chips, and checks height, size, offsetting and coplanarity.

3-D Non-Contact Surface Profiler SP-700/500 Series

The SP500 allows non-contact profiling of three-dimensional microscopic surface on objects such as semiconductor ICs, film, optical parts as well as LCD and PDP substrate. Not only can it display in 2D or 3D, the SP-500 also calculates a range of roughness parameters.
This is described in detail in the LCD, OLED and PDP section.

Chip Inspection System GEN3000T

The GEN3000T is a chip inspection system which offers fully-automatic, stable defect inspections of diced semiconductor chips.

ID Marker for Quality Control of Chips Wafer Titler

Strong tool for chip traceability.

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