Wafer Defect Inspection System INSPECTRA 1000EX-II
Overview
- The 1000EX-II can now be used for an expanded range of processes. In addition to final defect inspection of back end processing wafers, it can now also be put to use in wafer front end processes (such as etching, lithography, CMP and CVD) that require high-speed inspections.
- With high-speed inspections roughly twice as quick as the previous model, the Inspectra 1000EX, the 1000EX-II allows you to manage any die through 100% inspection. Furthermore, by enabling detection of defects at an early stage in the process, the 1000EX-II improves the productivity in back end processes.
- Using our unique DSI algorithm (based on the DSI comparison method), the 1000EX-II control a process variability enables automatic inspections as visual checks for ability to detect and reduce false defects.
- Indeed, this versatile device can also handle inspections of framed wafers for tilted and shifted die after dicing.
Composition
The 1000EX-II is comprised of a microscope optical system, high-resolution CCD camera, XYZ-θ stage, wafer loading/unloading robot, pre-aligner, original high-speed image processor and computer, etc. Each component is highly reliable, has minimal running costs and can be used safely in your production line.
Features
- High-speed inspection
- Fully-automatic
- DSI algorithm
- Easy operability
- High-magnification review of defects
- High-spec auto-focus built in
- Prober Data Link
- Image enhancement (LUT)
- Defect filtering
- 2-D Bump Inspection and Probe mark Inspection
- Computer-integrated manufacturing
- Automatic defect classification
- Sensitivity simulation
- Non-pattern inspection
- Inspection Result Analysis System
- Wafer cleaner
- Auto-Aligning Rotation
Specifications
| Samples | Silicon semiconductors, compound semiconductors, MEMS devices |
|---|---|
| Wafer size | 4-8" , 300 mm |
| Wafer thickness | Max. 4 mm |
| Cassettes | 2 units |
| Inspection algorithm | DSI Algorithm, others |
| Inspection time | 0.035sec/FOV (=Field of View) 15 sec for 6 inch wafer 19 sec for 8 inch wafer 27 sec for 300 mm wafer (incl. loading/unloading time) |
| Object lens | 1×, 2×, 5×, 10× (20×, 50× options available) |
| Standard functions | Image enhancement (LUT) Auto-focus Multi-FOV, multi-chip inspection Filtering by defect size Bad mark recognition and skipping 2-D Bump Inspection and Probe mark Inspection Sensitivity simulation |
| Utilities | AC200V, 15A, 50/60Hz; air; vacuum |
| Dimensions | 2185 mm(W) × 1150 mm(D) × 1931 mm(H); incl. computer rack |
| Options | Inker, ionizer, high-magnification review lens, video printer, wafer cleaner, compatibility with 2inch / 3inch compound semiconductors, flat-ring loading/unloading, offline review station, Dark Field Illumination, Active Auto Focus, ADC, non-pattern inspection, bad mark inspection, offline sensitivity simulator, offline ADC, 2D bump inspection. |
Specifications are subject to change due to product improvements.
