Wafer Pattern Inspection System INSPECTRA 7000R300

Overview

Composition

The 7000R300 is comprised of a microscope optical system, high-resolution CCD camera, XYZ-θ stage, wafer loading/unloading robot, pre-aligner, dedicated high-speed image processor and computer. Each component is highly reliable, has minimal running costs and can be used safely in your production line. There is also a backside inspection unit optionally available.

Features

Specifications

Samples Silicon semiconductors, compound semiconductors, MEMS devices
Wafer size 200 mm, 300 mm
Cassettes FOUP loading port × 2
Inspection algorithm DSI algorithm, others.
Inspection time 12 sec for 300 mm wafer
Object lens 1×, 2×, 5×, 10×, 20× (50× option available)
Standard functions Image enhancement (LUT)
Auto-focus
Multi-FOV, multi-chip inspection
Filtering by defect size
Sensitivity simulation
Ionizer
Utilities 3-phase AC200V (50/60Hz) 20A
Dimensions 3276 mm(W) × 1247 mm(D) × 2090 mm(H) (incl. computer rack)
Options High-magnification review lens, dark field illumination, filter changer, offline review station, ADC, Backside inspection unit for all wafers
Inspectra 7000R300 Wafer Exterior Inspection Device
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Inquriry
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