3-D Non-Contact Surface Profiler for Wafers SP-500WA
Overview
- The SP-500WA provides 3D profiling of bumps on wafers and IC chips, and checks height, size, offsetting and coplanarity.
- The 3D profiling principle uses a newly developed white light interferometry method to achieve high-speed, high-precision bump profiling.
- Alignment and focus are all done automatically, while the pass/fail decision is also made automatically by comparing with predetermined specifications.
Features
- Non-contact high-precision 3D measurement using vertical scanning interferometry (Height measurement resolution: 1 nm).
- New signal processing algorithm allows for high-speed scanning.
- 2D camera enables high-speed measurement of all on-screen objects (measurement time: a few seconds per shot).
- Field of view size can be adjusted by replacement of object lens (maximum field of view: approx. 7 × 5 mm).
- Extensive measurement range option available (maximum height measurement: 400 µm).
- Handles 4", 5", 6", 8" and 12" wafers.
- Automatic loading of wafers.
Specifications
| Measurement principle | White light interferometry |
|---|---|
| Signal processing algorithm | SB algorithm |
| Wafers inspected | 4", 5", 6", 8" and 12" wafers |
| Loading, unloading | Automatic loading/unloading by robot |
| Items measured | Areas (incl. bumps) are profiled in 3D, and subjected to the following inspections. (1) Bump height, coplanarity (2) Top shape (steps, inclines, roughness) (3) Bump size (e.g., x diameter, y diameter, area, cubic volume) (4) Others (e.g., offset, process capacity Cpk value) |
| Height measurement reproducibility | σ (average) = 0.02 µm |
| Height measurement range | 0-100 µm (maximum 400 µm optional available) |
| Height measurement resolution | 1 nm |
| Z-axis scan speed | Variable; maximum 214 µm/sec |
| Focus | Built-in auto-focus |
| Pixel resolution | Variable; maximum 512 × 480 pixels (1376 × 1040 pixel option available) |
| Measurement field | Can be adjusted by combining object lens and intermediate lens. |
| Inspection time | Depends on bump height, size, density and precision. Please contact us for details. |
| Clean room standard | Up to class 100 |
| Utilities | Power source, compressed air, vacuum |
Specifications are subject to change due to product improvements.
Sample Measurements
Measurement results (2D)
Measurement results (3D)
Chip map and measurement results (partial)
Wafer map showing bump height
