Wafer Edge Inspection System WE-1000
Overview
- Performs automatic inspections of wafer edges to check for cracks, peeling and chipping.
Features
- High-speed inspection: 15 seconds per 8” wafer (incl. loading/unloading time).
- Simultaneous inspection: The WE1000 can check the front and back surfaces and edges simultaneously.
- Can handle patterned wafers as well as bare.
- Function: OCR reader scans and reads wafer ID. There is also a sorter to re-sort wafers.
