Product site map by Division

Engineering Business Div.

Plant Business Div.

• Pharmaceutical Ingredient and Investigational Drug Plants
• Medical Pharmaceutical Intermediate Plants
• Pharmaceutical Manufacturing Plants
• Electronic Materials Plants
• High-performance Material Plants
• MICRO TOWER Series
• Polymer Plants (liquid-phase and solid-phase polymers for synthetic fibers)
• Spinning, Taking off, Taking up Facilities
• Advanced Processing Facilities (for industrial materials)
• Synthetic Resin Polymer Plants
• Super-absorbent resin manufacturing plants
• Juice Concentrators
• Inorganic Chemical Concentrators
• Latex Concentrators
• Organic solvent (e.c. acetic acid) collection devices
• Organic solvent (e.c. dimethylsulfoxide) collection devices
• Sugar-alcohol separators
• Salt separators
• Environment Simulation
• Environmental Assessment
• Plant Engineering Support
• Environmental Planning and Investigative Research
• Soil and Groundwater Contamination Surveys
• Support for Setting up in China
• Procurement Support in China

Industrial Machinery Business Div.

• Oriented Film Production Line
• Non-oriented Film Production Line
• Winding Machine
• Simultaneous Double-sided Coating Machine
• Thin Coating Machine
• Intermittent Coating Machine
• Roll to Sheet Coating Machine
• Optical Film Slitting Machine TS-18XCA
• 2-axis 2-stage Turret Slitting Machine TS-18YDT
• Metal Foil Slitting Machine TS-07YC
• Roll to Sheet Laminating Machine TSLS-11
• High Temperature Laminating Machine TLS-07/400
• Calendering Machine
• Secondary Cell Coating Machine TCS-0721
• Secondary Cell Calendering Machine
• Secondary Cell Slitter TS-07YD
• Secondary Cell Sheet Cutting Machine
• Large Electrode Stacking Machine
• Zig-zag Stacking Machine
• Winding Stacking Method
• Secondary Cell Packaging Machine
• OPC Coating Machine
• Thin Coating Machine TCS-1225
• High Temperature Laminating Machine TLS-07/400
• Metal Foil Slitting Machine TS-07YC
• Interior Leather-Urethane Molding Equipment
• Stringer Assembly Equipment
• FA Engineering
• Production Management Systems

Computer Aided Engineering Business Div.

• TIMON

Electronics Div.

Fine Process Manufacturing Dept.

• Reel to Reel COF Bonder FC3100
• Fully-Automatic COG/FOG/COF Bonder (for LSIs or FPCs) FG3000
• Line Type COG Bonder FG2000
• Line Type COG Bonder CL3000
• Line Type COG Bonder CL2000FW
• Semi-Automatic COG Bonder SA2000
• Semi Automatic ACF Transfer DA1000
• Semi Automatic Main Bonder DM1000
• Flip Chip Bonder (for SiP/COC/CSP ) FC3000
• Flip Chip Bonder (for SiP/COC/CSP) FC3000S
• Bonder for Large-sized Substrates (Applications: Embedded Packaging etc.) MD3000/3500
• Super High Accuracy Flip Chip Bonder (for optical devices) OF2000
• Flip Chip Bonder (for MCM/COF/CSP) FC2000 series
• Flip Chip Bonder (for Chip on Chip) FC2000X
• Manual Type Flip Chip Bonder (for R&D Purpose) FC100M
• Flip Chip Bonder for Surface Activated COC FC2000 (CoC)
• Flip Chip Bonder (for RF-ID Tag) CF2000R
• Vacuum Printing Encapsulation System VE500C
• Vacuum Printing System VE6500
• Proximity Exposure System TE2500/TE2535 (Roll to Roll)
• High-irradiance Exposure System For PSR TE2500H/TE2535H (Roll to Roll)
• Proximity & Hard-Contact Exposure System TE2538 (Roll to Roll)
• Hard-Contact Exposure System TE25A4
• Resist Roll Coater System TRC105/160 (Roll to Roll)
• Chemical Etching Technology for Polyimide Film and the Solution TPE3000

Display Systems Div.

• HS-830 Foreign Matter Inspection Device for FPDs
• 3-D Non-Contact Surface Profiler SP-700/500 Series
• TMT Series LCD mask Type Marking Titlers
• TRT-iW/THT Series Laser Type Marking Titlers
• TNT Series Optical Mask Type Marking Titlers
• TWT Series Wafer Titlers
• TGT Series Inner Glass Marking Titlers
• TRE, TLE Series Edge Exposure
• Laser Cutters
• TR-G5000 2D Code Reader with Separate Camera
• VS-F500 2D Code Reader with Separate Camera
• VS-F250 2D Code Reader with Built-in Camera (discontinued product)
• VS-HR3000 Hand-held 2D Code Reader (discontinued product)
• FB2100/FB2400 Lighting Probe for Large LCDs
• Probes for Small LCDs
• Lighting Probe Tools for Small LCDs
• Wafer Defect Inspection System INSPECTRA 1000EX-II
• Wafer Pattern Inspection System INSPECTRA 7000R300
• Wafer Edge Inspection System WE-1000
• 3-D Non-Contact Surface Profiler for Wafers SP-500WA
• 3-D Non-Contact Surface Profiler SP-700/500 Series
• Chip Inspection System GEN3000T
• ID Marker for Quality Control of Chips Wafer Titler
• TWT Series Dedicated Wafer Titlers

TSCoater Div.

• TSCoater (Toray Slit-nozzle Coater)
• Mura Checker for FPD MC Series
• Film Thickness Measurement System FTM Series

Electronic Machinery & Systems Div.

• High/Medium Concentration Measurement Type LC-750H
• Clean Gas Sampling Equipment Built-in Type LC-750H/PC-110
• Dirty Gas Sampling Equipment Built-in Type LC-750H/PC-111
• Medium/Low Concentration Measurement Type LC-750L
• Clean Gas Sampling Equipment Built-in Type LC-750L/PC-120
• Research/Experimental Use High Performance Type LC-850K, KS, KD
• General-Purpose Type LC-300
• Zirconia Oxygen Analyzer LC-450D
• Zirconia Oxygen Analyzer LC-450A
• Baking and N2 Reflow Use Analyzer RF-30
• Zirconia Oxygen Analyzer RF-400
• Separate Sensor Type SA25NW/LD-300
• Gas Flush Packaging Sampling Inspection Type LC-750F
• Zirconia Oxygen Analyzer LF-200
• Combustion Management Application Type SE-740/SE-740D
• Space-saving, Low-cost TOC-100
• High-function TOC-620
• For Pure Water and Recycled Water Applications TOC-780
• Automatic TOC Analyzer TOC-106
• High Speed Response TN-520
• Desktop TOC/TN Analyzer TNC-6000
• Online TOC/TN Analyzer TNC-6200
• Automatic Total Phosphorus/Total Nitrogen Analyzer TPN-6200
• Automatic Total Oxygen Demand Analyzer TOD-810C
• Automatic UV Analyzer UVT-300
• Mixing Nozzle for Injection Molding Machines
• Standard transducer
• Surface wave transducer
• Hydrophone
• Printer