Product site map

• Inspection
  • HS-830 Foreign Matter Inspection Device for FPDs
  • 3-D Non-Contact Surface Profiler SP-700/500 Series
• Titlers
  • TMT Series LCD mask Type Marking Titlers
  • TRT-iW/THT Series Laser Type Marking Titlers
  • TNT Series Optical Mask Type Marking Titlers
  • TWT Series Wafer Titlers
  • TGT Series Inner Glass Marking Titlers
  • TRE, TLE Series Edge Exposure
• Coater
  • TSCoater (Toray Slit-nozzle Coater)
  • Mura Checker for FPD MC Series
  • Film Thickness Measurement System FTM Series
• Laser Cutter
  • Laser Cutters
• Bonders
  • FPD Bonding
    • Reel to Reel COF Bonder FC3100
    • Fully-Automatic COG/FOG/COF Bonder (for LSIs or FPCs) FG3000
    • Line Type COG Bonder FG2000
    • Line Type COG Bonder CL3000
    • Line Type COG Bonder CL2000FW
    • Semi-Automatic COG Bonder SA2000
    • Semi Automatic ACF Transfer DA1000
    • Semi Automatic Main Bonder DM1000
• 2D Code Readers
  • TR-G5000 2D Code Reader with Separate Camera
  • VS-F500 2D Code Reader with Separate Camera
  • VS-F250 2D Code Reader with Built-in Camera (discontinued product)
  • VS-HR3000 Hand-held 2D Code Reader (discontinued product)
• Probes
  • FB2100/FB2400 Lighting Probe for Large LCDs
  • Probes for Small LCDs
  • Lighting Probe Tools for Small LCDs

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• Inspection
  • Wafer Defect Inspection System INSPECTRA 1000EX-II
  • Wafer Pattern Inspection System INSPECTRA 7000R300
  • Wafer Edge Inspection System WE-1000
  • 3-D Non-Contact Surface Profiler for Wafers SP-500WA
  • 3-D Non-Contact Surface Profiler SP-700/500 Series
  • Chip Inspection System GEN3000T
  • ID Marker for Quality Control of Chips Wafer Titler
• Exposure
  • TWT Series Dedicated Wafer Titlers
• Bonders
  • Flip Chip Bonders
    • Flip Chip Bonder (for SiP/COC/CSP ) FC3000
    • Flip Chip Bonder (for SiP/COC/CSP) FC3000S
    • Bonder for Large-sized Substrates (Applications: Embedded Packaging etc.) MD3000/3500
    • Super High Accuracy Flip Chip Bonder (for optical devices) OF2000
    • Flip Chip Bonder (for MCM/COF/CSP) FC2000 series
    • Flip Chip Bonder (for Chip on Chip) FC2000X
    • Manual Type Flip Chip Bonder (for R&D Purpose) FC100M
    • Flip Chip Bonder for Surface Activated COC FC2000 (CoC)
  • RF-ID Manufacturing Equipment
    • Flip Chip Bonder (for RF-ID Tag) CF2000R
• Encapsulation
  • Vacuum Printing Encapsulation System
    • Vacuum Printing Encapsulation System VE500C
    • Vacuum Printing System VE6500

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• FPC, TAB and COF Lines
  • Proximity Exposure Systems TE Series
    • Proximity Exposure System TE2500/TE2535 (Roll to Roll)
    • High-irradiance Exposure System For PSR TE2500H/TE2535H (Roll to Roll)
    • Proximity & Hard-Contact Exposure System TE2538 (Roll to Roll)
    • Hard-Contact Exposure System TE25A4
  • Resist Roll Coater System TRC105/160 (Roll to Roll)
• Polyimide Etching
  • Chemical Etching Technology for Polyimide Film and the Solution TPE3000

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• Oxygen Analyzers
  • For Semiconductors, Electronic Components, Baking Furnaces, N₂ Reflow Ovens
    • High/Medium Concentration Measurement Type LC-750H
    • Clean Gas Sampling Equipment Built-in Type LC-750H/PC-110
    • Dirty Gas Sampling Equipment Built-in Type LC-750H/PC-111
    • Medium/Low Concentration Measurement Type LC-750L
    • Clean Gas Sampling Equipment Built-in Type LC-750L/PC-120
    • Research/Experimental Use High Performance Type LC-850K, KS, KD
    • General-Purpose Type LC-300
    • Zirconia Oxygen Analyzer LC-450D
    • Zirconia Oxygen Analyzer LC-450A
    • Baking and N2 Reflow Use Analyzer RF-30
    • Zirconia Oxygen Analyzer RF-400
  • For Vacuum Deposition, Closed Furnaces
    • Separate Sensor Type SA25NW/LD-300
  • For Food Products
    • Gas Flush Packaging Sampling Inspection Type LC-750F
    • Zirconia Oxygen Analyzer LF-200
  • For Combustion Furnaces
    • Combustion Management Application Type SE-740/SE-740D
• Water Quality Analyzers
  • Automatic Total Organic Carbon Analyzers
    • Space-saving, Low-cost TOC-100
    • High-function TOC-620
    • For Pure Water and Recycled Water Applications TOC-780
    • Automatic TOC Analyzer TOC-106
  • Automatic Total Nitrogen Analyzers
    • High Speed Response TN-520
  • Automatic Total Organic Carbon/Total Nitrogen Analyzers
    • Desktop TOC/TN Analyzer TNC-6000
    • Online TOC/TN Analyzer TNC-6200
  • Automatic Total Phosphorus/Total Nitrogen Analyzers
    • Automatic Total Phosphorus/Total Nitrogen Analyzer TPN-6200
  • Automatic Total Oxygen Demand Analyzers
    • Automatic Total Oxygen Demand Analyzer TOD-810C
  • Automatic UV Analyzers
    • Automatic UV Analyzer UVT-300
• Fluid Process Equipment
  • Static In-tube Mixer
    • Mixing Nozzle for Injection Molding Machines
• Ultrasonic Sensors
  • Ultrasonic transducers
    • Standard transducer
    • Surface wave transducer
    • Hydrophone

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• Film Production Line
  • Oriented Film Production Line
  • Non-oriented Film Production Line
  • Winding Machine
• Coating Machine
  • Simultaneous Double-sided Coating Machine
  • Thin Coating Machine
  • Intermittent Coating Machine
  • Roll to Sheet Coating Machine
• Slitting Machine
  • Optical Film Slitting Machine TS-18XCA
  • 2-axis 2-stage Turret Slitting Machine TS-18YDT
  • Metal Foil Slitting Machine TS-07YC
• Laminating Machine
  • Roll to Sheet Laminating Machine TSLS-11
  • High Temperature Laminating Machine TLS-07/400
  • Calendering Machine

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• Coating Machine
  • Secondary Cell Coating Machine TCS-0721
• Calendering Machine
  • Secondary Cell Calendering Machine
• Slitting Machine
  • Secondary Cell Slitter TS-07YD
• Sheet Cutting Machine
  • Secondary Cell Sheet Cutting Machine
• Stacking Machine
  • Large Electrode Stacking Machine
  • Zig-zag Stacking Machine
  • Winding Stacking Method
• Cell Packaging Machine
  • Secondary Cell Packaging Machine

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• PDP/LCD Production Machine
  • Roll to Sheet Laminating Machine TSLS-11
• Film Production Line, High-Functionality Film Production Line
  • Oriented Film Production Line
  • Non-oriented Film Production Line
  • Winding Machine
• Film Production Line, Coating Machine
  • Simultaneous Double-sided Coating Machine
  • Thin Coating Machine
  • Intermittent Coating Machine
  • Roll to Sheet Coating Machine

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• OPC Production Machine
  • OPC Coating Machine
• CCL Production Machine
  • Thin Coating Machine TCS-1225
  • High Temperature Laminating Machine TLS-07/400
  • Metal Foil Slitting Machine TS-07YC

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• Automotive Parts Assembly
  • Interior Leather-Urethane Molding Equipment
• Aircraft Component Assembly
  • Stringer Assembly Equipment
• Custom Engineering
  • FA Engineering
  • Production Management Systems

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• Pharmaceutical Ingredient and Investigational Drug Plants
• Medical Pharmaceutical Intermediate Plants
• Pharmaceutical Manufacturing Plants

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• Electronic Materials Plants
• High-performance Material Plants
• Micro Chemical Plants
  • MICRO TOWER Series

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• Polymer Plants (liquid-phase and solid-phase polymers for synthetic fibers)
• Spinning, Taking off, Taking up Facilities
• Advanced Processing Facilities (for industrial materials)

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• Synthetic Resin Polymer Plants
• Super-absorbent resin manufacturing plants

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• Concentrators
  • Juice Concentrators
  • Inorganic Chemical Concentrators
  • Latex Concentrators
• Separation and Collection devices
  • Organic solvent (e.c. acetic acid) collection devices
  • Organic solvent (e.c. dimethylsulfoxide) collection devices
  • Sugar-alcohol separators
  • Salt separators

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• Printer
• Environment Simulation

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• Environment Simulation
• Environmental Assessment
• Plant Engineering Support
• Environmental Planning and Investigative Research
• Soil and Groundwater Contamination Surveys
• Support for Overseas Expansion
  • Support for Setting up in China
  • Procurement Support in China

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