Lecture at the 37th JIEP Annual Meeting of the Japan Institute of Electronics Packaging

A Toray Engineering employee will give a lecture on technologies and equipment for microLED display manufacturing at the 37th JIEP Annual Meeting of the Japan Institute of Electronics Packaging being held from March 13 to 15, 2023.

MicroLED displays, which are expected to become the next generation of displays, require advanced and precise manufacturing technology because they are made up of LED chips that are smaller than those used in conventional displays. This lecture will introduce Toray Engineering’s lineup of microLED display manufacturing equipment and the technologies behind them, as well as initiatives to enhance the rate of yield in the manufacturing process.

Overview of the lecture at the 37th JIEP Annual Meeting of the Japan Institute of Electronics Packaging

1. Theme	:	Initiatives to Enhance Rate of Yield in MicroLED Display Manufacturing
2. Date and time	:	Wednesday, March 15, 2023, 10:00 a.m.
3. Format	:	Hybrid format with online conferencing
4. Venue	:	Yagami Campus, Keio University
5. Lecturer	:	Hidetomo Umeda, Sales Engineering Team, Sales Dept., Business Div. I, Mechatronics & Fine Technology Business Div.
6. Content	:	Introduction of defect inspection system using luminescence technology, laser repair equipment, and mass transfer (transfer mounting) equipment and their technologies, as well as enhancement of yield rate prior to mass transfer (transfer mounting) process
7. How to apply	:	Applications can be made through the 37th JIEP Annual Meeting of the Japan Institute of Electronics Packaging website (link below, in Japanese). https://www.jiep.or.jp/event/convention/jiep2023s/index.php

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