Exhibit at “SEMICON Korea 2024”

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit at “SEMICON Korea 2024” held from January 31 (Wed.) through February 2 (Fri.), 2024.

At the event, Toray Engineering will present total solutions for cutting-edge semiconductor manufacturing, including packaging equipment (flip chip bonders) and laser trimming equipment.
We will also exhibit a panel introducing our unique integrated manufacturing technology for the efficient manufacturing of microLED displays, which are attracting attention as next-generation displays.

Toray Engineering continues to contribute to society, offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.

Below are additional details about the exhibition.

Note

1. Exhibition name	:	SEMICON Korea 2024
2. Date	:	January 31 to February 2
3. Venue	:	Seoul COEX, South Korea
4. Official website	:	https://www.semiconkorea.org/
5. Toray Engineering Booth	:	Hall D　‐　D904
6. Exhibition	:	Semiconductor packaging equipment (flip chip bonders) Laser trimming equipment MicroLED display manufacturing technology

BACK