Toray Engineering Receives the Minister of Economy, Trade and Industry Award at the 37th Advanced Technology Award

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter "Toray Engineering") received the Minister of Economy, Trade, and Industry Award at the 37th Advanced Technology Award hosted by Sankei Shimbun. The award was given jointly to Toray Engineering, Yokohama National University (hereinafter "YNU") and DISCO Corporation (hereinafter "DISCO") for the theme "Development of Hybrid Bonding and Its Application to Power-Efficient Chiplet Integration."

Currently, semiconductors face increasing demands for higher performance to handle the explosive growth of data processing in society. They also require further energy efficiency to reduce power consumption, in addition to achieving lower costs to enable the widespread adoption of high-performance semiconductor devices.
In response to these challenges, YNU, DISCO, and Toray Engineering have been jointly developing hybrid bonding technology that does not use traditional adhesives and tin typically employed in semiconductor integration.
On this occasion, the establishment and elucidation of a new chip integration method by YNU, the development of particle-less blade dicing technology by DISCO, and the realization of a transportation system by Toray Engineering that enables non-contact pickup and flipping of dies from wafers on the bonding surface were recognized.

Toray Engineering continues to contribute to society, offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how to achieve a balance between digital transformation (DX) and green transformation (GX).

＜Reference materials＞
Advanced Technology Award: Introduction and awarded papers (in Japanese)
https://www.sankei-award.jp/sentan/jusyou/