August 28, 2024
Toray Engineering Co., Ltd.
Exhibit at “SEMICON Taiwan 2024”
Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit at “SEMICON Taiwan 2024” held from September 4 (Wed.) through September 6 (Fri.), 2024.
At the event, Toray Engineering will present packaging equipment (flip chip bonders) that supports chiplet, a state-of-the-art semiconductor packaging technology in which multiple semiconductor chips are mounted in a single package; laser trimming equipment; and the semiconductor inspection system INSPECTRA series, used in manufacturing processes for compound semiconductors and microLED displays.
We will also exhibit our total solution for PLP (panel level package), a batch manufacturing technology using panel-shaped substrates, which is currently expected to offer significant cost advantages in improving the efficiency of semiconductor packaging.
Toray Engineering continues to contribute to society, offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.
Below are additional details about the exhibition.
Note
| 1. Exhibition name | : | SEMICON Taiwan 2024 |
| 2. Date | : | September 4–6, 2024 |
| 3. Venue | : | Taipei Nangang International Exhibition Center |
| 4. Official website | : | https://www.semicontaiwan.org/en |
| 5. Booth No. | : | Hall1 K2560 |
| 6. Exhibition | : |
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