Exhibit at “SEMICON Taiwan 2024”

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit at “SEMICON Taiwan 2024” held from September 4 (Wed.) through September 6 (Fri.), 2024.

At the event, Toray Engineering will present packaging equipment (flip chip bonders) that supports chiplet, a state-of-the-art semiconductor packaging technology in which multiple semiconductor chips are mounted in a single package; laser trimming equipment; and the semiconductor inspection system INSPECTRA series, used in manufacturing processes for compound semiconductors and microLED displays.
We will also exhibit our total solution for PLP (panel level package), a batch manufacturing technology using panel-shaped substrates, which is currently expected to offer significant cost advantages in improving the efficiency of semiconductor packaging.

Toray Engineering continues to contribute to society, offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.
Below are additional details about the exhibition.

Note

1. Exhibition name	SEMICON Taiwan 2024
2. Date	September 4–6, 2024
3. Venue	Taipei Nangang International Exhibition Center
4. Official website	https://www.semicontaiwan.org/en
5. Booth No.	Hall1 K2560
6. Exhibition	Semiconductor packaging equipment (flip chip bonders) Semiconductor inspection system INSPECTRA series Total solution for PLP