Exhibit at “SEMICON Japan 2024”
December 03, 2024
Toray Engineering Co., Ltd.
Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit at “SEMICON Japan 2024” held from December 11 (Wed.) through 13 (Fri.), 2024.
In this year’s exhibition, TASMIT, Inc., a Toray Engineering Group company, will introduce the INSPECTRA series of semiconductor Wafer inspection system.
We are proposing a wide range of products, including the high-grade model INSPECTRA® SR-Ⅳ, which has improved inspection performance, equipment reliability, and usability, as well as the PL series for compound semiconductors such as Si, SiC, and GaN, and the IR series, which is ideal for inspecting internal defects. These products are inspection solutions that to meet the rising demand for automotive power semiconductors, driven by the increasing popularity of electric and hybrid vehicles, and the growing AI server semiconductor market, driven by the increasing demand for AI.
Toray Engineering continues to contribute to society, offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.
Below are additional details about the exhibition.
Note
1. Exhibition name | SEMICON Japan 2024 |
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2. Date | December 11 to 13, 2024 |
3. Venue | Tokyo Big Sight (Tokyo International Exhibition Center) |
4. Official website | https://www.semiconjapan.org/en |
5. Toray Engineering Booth | East Hall 5, 5507 |
6. Exhibition | INSPECTRA Series Semiconductor Inspection System |
