Exhibit at “SEMICON Korea 2025”

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit at “SEMICON Korea 2025” held from February 19 (Wed.) through February 21 (Fri.), 2025.

At the event, Toray Engineering will present packaging equipment (flip chip bonders) that supports chiplet, a state-of-the-art semiconductor packaging technology in which multiple semiconductor chips are mounted in a single package; and laser trimming equipment.
We will also exhibit our total solution for PLP (panel level package), a batch manufacturing technology using glass substrates, which is currently expected to improve the efficiency of semiconductor packaging. Our exhibit will focus on the "TRENG-PLP Coater," a coating system that enables the formation of fine redistribution layers on substrates, as part of the total solution proposed by the Toray Group.

Toray Engineering continues to contribute to society, offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.

Below are additional details about the exhibition.

Note

1. Exhibition name	SEMICON Korea 2025
2. Date	February 19 (Wed.) through February 21 (Fri.), 2025
3. Venue	Seoul COEX, South Korea
4. Official website	https://www.semiconkorea.org/
5. Toray Engineering Booth	Hall D (3rd floor) Booths D926 and D932
6. Exhibition	Semiconductor packaging equipment (flip chip bonders) Laser trimming equipment Total solution for PLP