Exhibit at “SEMICON China 2025”

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit at “SEMICON China 2025” held from March 26 (Wed.) through March 28 (Fri.), 2025.

In this year’s exhibition, TASMIT, Inc., a Toray Engineering Group company, will introduce the INSPECTRA^® Series of semiconductor wafer inspection system.
Toray Engineering will showcase semiconductor inspection and measurement systems for a variety of applications, including the latest model of the high-grade INSPECTRA^® SR-IV, which has improved inspection performance as well as system reliability and usability, the PL series for compound semiconductors such as Si, SiC, and GaN, and the IR series, which is ideal for inspecting internal defects.

Toray Engineering will continue to contribute to society by offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.
Below are additional details about the exhibition.

Note

1. Exhibition name	SEMICON China 2025
2. Date	March 26 to 28
3. Venue	Shanghai New International Expo Centre, Shanghai, China
4. Official website	https://www.semiconchina.org/en
5. Toray Engineering Booth	Hall N2, N2671
6. Exhibition	Semiconductor inspection system INSPECTRA® Series