Gold Sponsor for ICEP-IAAC 2025, an International Conference on Semiconductor Packaging Technology
April 8, 2025
Toray Engineering Co., Ltd.
Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) is a Gold Sponsor for the 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC 2025) being organized by The Japan Institute of Electronics Packaging from April 15 (Tues.) to 19, 2025 (Sat.) in Nagano Prefecture, Japan.
At ICEP-IAAC 2025, Toray Engineering will have a booth introducing products and technologies for the field of advanced semiconductor packaging. Specifically, the booth will introduce solutions for panel level packaging. They include the TRENG-PLP Coater, a high-accuracy coating device that creates detailed rewiring layers on glass substrates; a large glass substrate inspection system that detects cracks and other defects; and the UC5000, a high-accuracy semiconductor packaging equipment compatible with large glass panels. On April 18, there will also be a presentation on the flux-less bonding process by an employee of Toray Engineering.
Toray Engineering will continue to contribute to society by offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.
Below are additional details about the exhibition.
Note
I. About ICEP-IAAC 2025
| 1. Period: | April 15 to 19, 2025 |
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| 2. Venue: | Wakasato Municipal Cultural Hall, Nagano City |
| 3. Official website: | https://www.jiep.or.jp/icep/ |
II. About Toray Engineering’s booth
| 1. Location: | Booth number ⑮ |
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| 2. Exhibits: | Products and technologies for advanced semiconductor packaging ＜Reference＞ Information of relevant systems for advanced semiconductor packaging
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III. Toray Engineering’s presentation at the conference
| 1. Date and time: | FE2-4, 12:40 to 14:20, April 18, 2025 |
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| 2. Presenter: | Kentaro Mihara, engineer, Research & Development Department, Business Div. I |
| 3. Theme: | Optimized Flux-Less Bonding Process for High Throughput Using Simplified Equipment |