Exhibit at “SEMICON SEA 2025”
May 13, 2025
Toray Engineering Co., Ltd.
Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit our products within the Toray Group booth at the Sands Expo and Convention Centre in Singapore “SEMICON SEA 2025” held from Tuesday, May 20 to Thursday, May 22, 2025.
At our panel, in addition to a series of various devices used in semiconductor manufacturing processes, Toray Engineering will have a booth introducing products and technologies for the field of advanced semiconductor packaging. Specifically, the booth will introduce solutions for panel level packaging. They include the TRENG-PLP Coater, a high-accuracy coating device that creates detailed rewiring layers on glass substrates; a large glass substrate inspection system that detects cracks and other defects; and the UC5000, a high-accuracy semiconductor packaging equipment compatible with large glass panels.
Toray Engineering will continue to contribute to society by offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.
Below are additional details about the exhibition.
Note
Ⅰ．Exhibition Overview:
| 1. Location | Sands Expo and Convention Centre（Singapore） Level 3 Booth L3112 |
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| 2. Exhibits |
Products and technologies for advanced semiconductor packaging ＜References＞ Information of relevant systems for advanced semiconductor packaging
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(For Reference)
“SEMICON SEA 2025” Official Website https://www.semiconsea.org/