Winner of the Excellence Award in the Semiconductor Manufacturing Equipment Category of the 31st Semiconductor of the Year 2025

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”), together with its group company TASMIT, Inc. (head office: Yokohama, Kanagawa; CEO: Kenji Sato; hereinafter “TASMIT”), received the Excellence Award for “Development and Deployment of Inspection, Coating, and Packaging Equipment for Panel Level Packaging” in the semiconductor manufacturing equipment category of the 31st Semiconductor of the Year 2025 award sponsored by Electronic Device Industry News (Sangyo Times, Inc.). This is the fourth consecutive year that the Toray Engineering Group has received this award.

Today, the rapid evolution of generative AI has resulted in a proliferation of hyperscale data centers. This in turn is driving the need for higher performance and enhanced production capabilities in semiconductor packaging. As semiconductor manufacturers around the world are beginning to shift to manufacturing with large glass substrates (panel level packaging; PLP), which enable highly efficient manufacturing, the Toray Engineering Group is working to develop and sell products and technologies for the advanced semiconductor packaging field.
This year’s award recognized the TRENG-PLP Coater, a high-accuracy coating device that creates detailed rewiring layers on glass substrates, a large glass substrate inspection system that detects cracks and other defects, and the UC5000, a high-accuracy semiconductor packaging equipment for large glass panels, among other solutions for PLP.

Toray Engineering will continue to contribute to society by offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.

Reference materials:

• Information on equipment related to advanced semiconductor packaging
  https://www.toray-eng.co.jp/semiconplp/

• Information on 31st Semiconductor of the Year 2025
  https://www.sangyo-times.jp/seminarDtl.aspx?ID=595