Exhibit at the Next Generation Communication Technology & Solutions Expo "COMNEXT 2025"

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit a poster presentation at the booth of NEDO (New Energy and Industrial Technology Development Organization) during the Next Generation Communication Technology & Solutions Expo "COMNEXT 2025", held from July 30 (Wed.) through August 1 (Fri.), 2025.

Toray Group will present its proprietary materials and technologies developed for high-speed and high-precision bonding of optical semiconductor devices onto silicon substrates, aiming to support the realization of low-power data centers through the adoption of optical communication, which offers lower energy loss than electrical communication.

Toray Engineering will continue to contribute to society by offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.
Below are additional details about the exhibition.

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