Launch of Global Website for Panel Level Packaging (PLP) Technology for Advanced Semiconductors

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) has launched a new website introducing its product lineup compatible with Panel Level Packaging (PLP) technology, which is gaining attention in the advanced semiconductor field. The site showcases the features and capabilities of our equipment for multiple manufacturing processes—such as coating, inspection, and bonding—designed for PLP, a next-generation semiconductor packaging technology expected to play a key role in the industry.

Toray Engineering will continue to contribute to society by offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.