Exhibit at “SEMICON Taiwan 2025”

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “TRENG”) will exhibit at “SEMICON Taiwan 2025” held from September 10 (Wed.) through September 12 (Fri.), 2025.
In this year’s exhibition, TRENG will introduce its total solution for the batch manufacturing technology “PLP (Panel Level Package),” which is expected to deliver significant cost advantages by improving the efficiency of semiconductor packaging. This solution consists of a group of equipment corresponding to each process of coating, inspection, and bonding, leading to a highly efficient manufacturing process using panel-shaped substrates.
In addition, we will also showcase flip chip bonders compatible with the cutting-edge Chiplet technology, which integrates multiple semiconductor chips into a single package and the semiconductor inspection equipment INSPECTRA Series, which supports the manufacturing processes of compound semiconductors, power semiconductors such as SiC, and micro LED.

Toray Engineering continues to contribute to society, offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.
Below are additional details about the exhibition.

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