Exhibit at the Comprehensive Digital Innovation Expo "CEATEC 2025"

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit a poster presentation at the booth of NEDO (New Energy and Industrial Technology Development Organization) during the Comprehensive Digital Innovation Expo "CEATEC 2025", held from October 14 (Tue.) through October 17 (Fri.), 2025.

Toray Group will present its proprietary materials and technologies developed for high-speed and high-precision mounting of optical semiconductor devices onto silicon substrates, aiming to support the realization of low-power data centers through the adoption of optical communication, which offers lower energy loss than electrical communication. Toray Engineering will also introduce a newly developed ultra-thin chip mounting technology.

Toray Engineering will continue to contribute to society by offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.

Below are additional details about the exhibition.

Note

1. Exhibition name	the Comprehensive Digital Innovation Expo "CEATEC 2025"
2. Date	October 14 to October 17, 2025
3. Venue	Makuhari Messe
4. Official website	https://www.ceatec.com/en/
5. Booth	Booth 4H220, Hall 4
6. Exhibition	High-Speed Mounting Technology for Optical Communication Devices

Reference materials:
Information on related equipment
https://www.toray-eng.com/news/2025/20250828.html