Exhibit at “SEMICON Europa 2025”

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit at “SEMICON Europa 2025” held from November 18 (Tue.) through 21 (Fri.), 2025.

In this year’s exhibition, TASMIT, Inc., a Toray Engineering Group company, will introduce the INSPECTRA series of semiconductor wafer inspection system.
We offer a comprehensive lineup of inspection solutions, including the latest model INSPECTRA^® SR-Ⅳ, which delivers enhanced inspection performance, reliability, and usability, as well as the PL series for compound semiconductors such as Si, SiC, and GaN, and the IR series, which is ideal for inspecting internal defects.
In addition, we will introduce its solution for the batch manufacturing technology “PLP (Panel Level Package),” which is expected to deliver significant cost advantages by improving the efficiency of semiconductor packaging.
We will also introduce the INSPECTRA demo room at Toray Engineering Europe GmbH (Munich, Germany), the European sales and customer service base.

Toray Engineering continues to contribute to society, offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.
Below are additional details about the exhibition.

Note

1. Exhibition name	SEMICON Europa 2025
2. Date	November 18 to 21, 2025
3. Venue	MESSE MÜNCHEN (Munich, Germany)
4. Official website	https://www.semiconeuropa.org/
5. Toray Engineering Booth	Hall C1, C1810
6. Exhibition	INSPECTRA Series Semiconductor Inspection System