Exhibit at “SEMICON Japan 2025”

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit at “SEMICON Japan 2025” held from December 17 (Wed.) through 19 (Fri.), 2025.

In this year’s exhibition, TASMIT, Inc., a Toray Engineering Group company, will introduce the INSPECTRA series of semiconductor wafer inspection system.
We offer a comprehensive lineup of inspection solutions, including the latest model INSPECTRA^® SR-Ⅳ, which delivers enhanced inspection performance, reliability, and usability, as well as the PL series for compound semiconductors such as Si, SiC, and GaN, and the IR series, which is ideal for inspecting internal defects.
In addition, we will introduce its solution for the batch manufacturing technology “PLP (Panel Level Package),” which is expected to deliver significant cost advantages by improving the efficiency of semiconductor packaging.

Toray Engineering continues to contribute to society, offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.
Below are additional details about the exhibition.

Note

1. Exhibition name	SEMICON Japan 2025
2. Date	December 17 to 19, 2025
3. Venue	Tokyo Big Sight (Tokyo International Exhibition Center)
4. Official website	https://www.semiconjapan.org/en
5. Toray Engineering Booth	East Hall 4, 4908
6. Exhibition	INSPECTRA Series Semiconductor Inspection System