Exhibit at “SEMICON China 2026”

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit at “SEMICON China 2026” held from March 25 (Wed.) through March 27 (Fri.), 2026.

In this year’s exhibition, TASMIT, Inc., a Toray Engineering Group company, will introduce the INSPECTRA^® Series of semiconductor wafer inspection system.
Toray Engineering will showcase semiconductor inspection and measurement systems for a wide range of applications, including the latest model of the high-grade INSPECTRA^® SR-IV, which has improved inspection performance as well as system reliability and usability, the INSPECTRA^® PL Series for compound semiconductors such as Si, SiC, and GaN used in automotive power semiconductor applications; and the INSPECTRA^® GR‑X, a glass substrate inspection system designed for PLP (Panel Level Package) applications, which is expected to deliver cost advantages through more efficient semiconductor packaging processes.

Toray Engineering will continue to contribute to society by offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.
Below are additional details about the exhibition.

Note

1. Exhibition name	SEMICON China 2026
2. Date	March 25 to 27
3. Venue	Shanghai New International Expo Centre, Shanghai, China
4. Official website	https://www.semiconchina.org/en
5. Toray Engineering Booth	Hall N2, N2775
6. Exhibition	Semiconductor inspection system INSPECTRA® Series