Exhibit at “SEMICON Taiwan 2026”

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “TRENG”) will exhibit at “SEMICON Taiwan 2026,” to be held at Taipei Nangang Exhibition Center in Taipei from September 2 (Wed.) through September 4 (Fri.), 2026.

At this year's exhibition, TRENG will present its PLP (Panel Level Package) solution, a large-area, high-precision packaging technology that uses large glass substrates and offers significant cost advantages by improving the efficiency of semiconductor packaging. The solution includes coating, inspection, and bonding systems and enables a highly efficient manufacturing process using panel-shaped substrates.
TRENG will also showcase its INSPECTRA Series of optical semiconductor wafer inspection equipment, which supports manufacturing processes for AI-related semiconductor devices, including logic, memory, optical, power, and sensors, power semiconductors including compound semiconductors and SiC, and microLEDs. It will also display its NGR Series of electron-beam semiconductor wafer pattern inspection equipment for advanced semiconductors with shrinking feature sizes and increasing integration.

Toray Engineering continues to contribute to society, offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.
Below are additional details about the exhibition.

Note

1. Exhibition name	SEMICON Taiwan 2026
2. Date	September 2–4, 2026
3. Venue	Taipei Nangang Exhibition Center (Taipei)
4. Official website	https://www.semicontaiwan.org/en
5. Toray Engineering Booth	J2234
6. Exhibition	Equipment for PLP coating, inspection, and bonding Optical semiconductor wafer inspection equipment, INSPECTRA Series Electron-beam semiconductor wafer pattern inspection equipment, NGR5000 Series