Conducting a Lecture at the 10th Next-Generation Electronic Packaging System Technology Seminar
September 4, 2026
Toray Engineering Co., Ltd.
Toray Engineering Co., Ltd. (hereinafter “Toray Engineering”) will give a lecture on September 11, 2026, at the 10th Next-Generation Electronic Packaging System Technology Seminar organized by the Kanagawa Institute of Industrial Science and Technology (KISTEC). The lecture will cover the results of joint work with KISTEC on the development of bonding technology for ultra-thin semiconductor chips.
Note
| 1. Theme | Development of Bonding Technology for Ultra-Thin Semiconductor Chips and Optoelectronic Fusion Devices |
|---|---|
| 2. Date and time | Friday, September 11, 2026, 4:00 p.m.-4:30 p.m. |
| 3. Venue | KISTEC Ebina Headquarters (Ebina, Kanagawa Prefecture) |
| 4. Lecturer | Tatsuya Okada, Research & Development Department, Research & Development Division |
| 5. Content | The presentation will introduce the development of ultra-thin semiconductor chip bonding technology being jointly pursued by Toray Engineering and KISTEC. In particular, it will report the results of developing laser transfer technology that enables ultra-thin chips to be transferred and mounted, and discuss the prospects for applying this technology to the bonding of optoelectronic fusion devices. |
| 6. Official website | https://www.kistec.jp/nepstech/report/ (in Japanese) |