Exhibiting at the 3rd Kyushu Semiconductor Industry Expo

Toray Engineering Co., Ltd. (Head Office: Chuo-ku, Tokyo; President: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit poster presentations at the 3rd Kyushu Semiconductor Industry Expo, which will be held at Marine Messe Fukuoka from September 30 (Wed.) to October 1 (Thu.), 2026.

Toray Engineering will introduce Proprietary ultra-thin chip mounting technology for Co-Packaged Optics (CPO) devices and Low-Temperature Plasma CVD Technology for Semiconductors, both currently under development.

Toray Engineering’s proprietary laser transfer technology will contribute to the mass production of Co-Packaged Optics (CPO) devices by enabling the high-speed mounting of ultra-thin optical devices, such as III-V compound semiconductor devices, onto photonic integrated circuits (PICs). The Low-Temperature Plasma CVD Technology for Semiconductors enables the deposition of low-stress thin films at temperatures below 100°C, helping reduce thermal damage during the deposition process and allowing application to heat-sensitive materials.

At the exhibition, visitors will be able to learn about the features and potential applications of these technologies through panel displays, samples, and technical demonstration videos.

Toray Engineering will continue to contribute to society by offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.

Below are additional details about the exhibition.

Note

1. Exhibition name	The 3rd Kyushu Semiconductor Industry Expo
2. Date	September 30 - October 1, 2026
3. Venue	Marine Messe Fukuoka Halls A & B
4. Official website	https://k-semi.jp/
5. Booth	B8-1 (within the Toray Group Booth)
6. Exhibition	Proprietary ultra-thin chip mounting technology for Co-Packaged Optics (CPO) devices Low-Temperature Plasma CVD Technology for Semiconductors