Exhibit at “SEMICON Europa 2026”

Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter “Toray Engineering”) will exhibit at “SEMICON Europa 2026” held from November 10 (Tue.) through 13 (Fri.), 2026.

In this year’s exhibition, TASMIT, Inc., a Toray Engineering Group company, will introduce the INSPECTRA series of semiconductor wafer inspection system.

With the advancement of Silicon Photonics, Advanced Packaging, and sensing technologies driven by the AI market, as well as increasing in power demand resulting from the rapid expansion of AI data centers, demand is growing for semiconductors and electronic devices that contribute to higher performance and improved energy efficiency.

We will present a broad lineup of inspection and metrology solutions, including the latest INSPECTRA^® SR-IV, featuring enhanced inspection performance, reliability, and usability; the IR Series for internal defect inspection using IR technology; and the OM Series for overlay measurement.

We will also introduce the INSPECTRA demo room at Toray Engineering Europe GmbH (Munich, Germany), the European sales and customer service base.

Toray Engineering continues to contribute to society, offering cutting-edge solutions for Monozukuri (manufacturing) through its technology, engineering, and know-how.
Below are additional details about the exhibition.

Note

1. Exhibition name	SEMICON Europa 2026
2. Date	November 10 to 13, 2026
3. Venue	MESSE MÜNCHEN (Munich, Germany)
4. Official website	https://www.semiconeuropa.org/
5. Toray Engineering Booth	Hall B1, B1846
6. Exhibition	INSPECTRA Series Semiconductor Inspection System