Software package for analyzing thermoset resins
This system predicts resin flow of thermoset resins in complex structural components and can be used to predict warpage, deformities during encapsulation of semiconductors (IC packages), and warpage of insert parts.
Deformities during encapsulation that can be predicted include incomplete filling and wire sweep.
In addition, it can be used to measure the physical properties of thermoset resins. This is an all-in-one package that comprises all these features.
For details, please check our 3D TIMON Web site by clicking on the link below.
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