Wafer Inspection System "INSPECTRA®" Series

Wafer inspection system

Wafer inspection system "INSPECTRA® SR" series

Wafer inspection system "INSPECTRA® FR" series

Wafer inspection system "INSPECTRA® TR" series


Highest speed in the industry
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing.
INSPECTRA® series are wafer inspection systems with high speed and high sensitivity.
Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.


Wafer inspection system "INSPECTRA®" series lineup

SR series Feature Work piece size
7000SR200 Specialized design for "clean class 1" such as wafer front-end process (Etching, Litho, CMP, CVD and so on) required high clean class.
Contribution to process improvement with high performance of early detection of source of trouble by process monitoring with 100% inspection.
2~8 inch
7000SR300 8~12 inch
3000SR200 Quad-speed up than EX-II, to prevent missing defects, supporting the 100% inspection with enough required sensitivity.Suitable for high sensitivity inspection of products such as LSI, CIS and MEMS same as 7000SR. 2~8 inch
3000SR300 8~12 inch

TR series Feature Work piece size
3000TR200 Providing a superior cost performance as general-purpose equipment with an abundance of functions.Suitable for not only "Si" products but also Sic, GaN and GaAS, furthermore compound semiconductors and LED. 2~8 inch
3000TR300 8~12 inch

FR series Feature Work piece size
3000FR200 Optimal for inspection following dicing or expanding.Automatic tape frame feed.
(*1) Tape frame size: 300 mm
(*2) Tape frame size: 450 mm
– 300mm(*1)
3000FR300 – 450mm(*2)
Convenient standard functions Sensitivity simulation, PAD inspection, defect color image storage, bad mark recognition, chip rotation/misalignment correction (FR series), etc.
Extensive range of options Differential interference optical system, non-pattern inspection, automatic defect categorization, full image storage, result analysis function, wafer sorter, wafer cleaner, inker, support for various wafer transport methods, support for various communications methods, etc.
Usage track record LSI, CISs, MEMS, LED, bump/TSV/Via inspection, power semiconductor, SiC, GaN, compound semiconductor


Technological Field
Technology >> Image processing > Exterior Inspection
Industry Sector
Industry sector >> Semiconductors > Semiconductor inspection equipment