Surface Profiler measurement system "SP series"

Non-contact, non-destructive measurement of nm-order surface shapes



Surface Profiler measurement system


SP series, high accuracy 3D surface profiler measurement system with white light interferometry.


Transparent film measurement system
It is possible to measure up to 50 nm thin film and transparent film, moreover the product with transparent film impreviously by "Our original algorithm".
The product with a film which is not able to be measured by other system nor other algorithm can be measured with sufficient accuracy.This system is perfect for customers who want to perform non-destructive measurement but don’t have the equipment to do so.

  • Transparent film on transparent substrate
  • Surface/Interface configuration/Interface thickness of transparent substrate
  • Surface/Interface configuration of transparent film
  • Bump height "on or throught" transparent film
  • Distribution of film thickness differently than general film thickness measurement

High scanning speed
Vertical scanning speed: 214µm/sec * meet the needs of making quick scanning time possible as market requests

Bump and TSV automated measurement with automated asperity measurement Micro bump, TSV, deep-trench can be contactless measured with high accuracy "Automated asperity measurement" can measure the following items.

  • "Height variation" and "Position gap" of Bump
  • Diameter of bump top and bump bottom
  • Coplanarity of measuremet area
  • Cubic Volume
  • "Depth" and "Ddiameter" of TSV
  • "Depth" of deep trench
  • Other


Range of models for different applications.


Features Perfect for research and development uses such as sample measurement of a large number of sample types under various conditions!
Product Line-up Manual Type
Size of a stage 150mm×150mm


Features Built-in automatic XY stage.Contains automatic Z axis and autofocus functions.
Product Line-up Semi-Automatic type
Size of a stage 200mm×200mm


Features Supports sizes up to 12 inches.
Optimal for production management.
Product Line-up For wafers
Size of a stage Wafers:


Features Attachment type, mountable in a variety of devices.
Product Line-up Module type
Size of a stage
Interference objective lenses 2x, 5x, 10x, 20x, 50x
Camera Standard: 1/3 inch (effective pixels: 512 x 480) Option: 2/3 inch (effective pixels: 1376 x 1040)
Height display resolution 0.001um/0.01nm (switchable)
Pixel resolution 0.13um–
Vertical operation range Standard: 0 to 100 um Option: 0 to 400 um
Standard components Surface shape measurement software, 3D shape display software, transparent film measurement function (SP-700 only), vibration elimination platform, etc.
Option Automatic bump measurement software, multifunction 3D shape display software, stitching software, high-speed camera, active vibration elimination platform, etc. Customization available
Measurement examples Bumps, Trench, Wafer roughness, LED (PSS), SiC Etchi-Pits, Film, Trancesparent Film, PV, etc…

* 1, *2 According to studies performed by Toray Engineering


Technological Field
Technology >> Image processing > Exterior Inspection
Industry Sector
Industry sector >> Semiconductors > Semiconductor inspection equipment