Laser Trimming & Transfer Equipment LMT-TR Series for Micro/Mini LED

Contributing to Micro/Mini LED manufacturing process efficiency by its applicability to various processes

Features

This proprietary laser technology is applicable to the following processes: 1. LED Trimming, 2. LED 1by1 Transfer, 3. LED Mass Transfer, and 4. Metal Cutting.

  • Efficient repair process is achievable through smooth exchange of inspection data with our inspection equipment, INSPECTRA Series.
  • Applicable to various processes and supports research and development to mass production of Micro/ Mini LED manufacturing processes.
Laser Trimming & Transfer Equipment LMT-TR Series for Micro/Mini LED

Specifications

Laser Wavelength 266nm / 532nm
Sub. Size (Donor) 4・6inch
Sub. Material (Donor) sapphire, quartz
Sub. Size (Target) 370 x 470mm (max)
Spot Size □2〜150µm
Position Accuracy ±2µm (repeatability)
Process Speed 0.7sec/1process
Equipment Size W260mm x D2300mm x H2100mm

Application Examples

Inspection NG Chip Trimming 1 by 1 Transfer
Microscope Inspection NG Chip Trimming 1 by 1 Transfer
SEM Image
before after
Metal Cut before after