MT Series Mass Transfer Bonder for Micro/Mini LED

Achieving high throughput with a dedicated design for Micro/Mini LED

Based on achievements in the semiconductor industry, stable and high-throughput pick & place mass transfer has been realized through a design specifically tailored for Micro/Mini LED.

Features

  • Enabling high-accuracy (±1.5µm) through moving-search function and high-rigidity frame.
  • Our unique ceramic heater, pressure, and position control methods allow for a variety of temperature, pressure, and height profiles.
  • Ensuring optimal gap through our unique head gap control function.
  • Allowing pressure ranges from low to high by changing the head.
MT Series Mass Transfer Bonder for Micro/Mini LED

Specifications

MT3000L FC3000MS
Purpose mass production・pilot line R&D small-quantity production
Work Transfer auto manual
Sub. Size 370 x 470mm (max) 300 x 300mm (max)
Wafer Size 4・6inch 4・6inch
Cycle Time 3sec/shot 12sec/shot
Alignment Accuracy ±1.5µm ±2.0µm

Image of LED after Transfer

Image of LED after Transfer