Flip Chip Bonder (for SiP/COC/CSP)



  • Semi-automatic flip chip bonder.
  • Able to meet needs ranging from R&D to small volume production.
  • Capable of stacking application in various programs for handling 3D packaging.
  • Can be used for a variety of bonding processes and devices, such as ultrasonic, flux, NCP, NCF, TSV, and Cu pillars.


  • Able to achieve high accuracy (±2 μm) with its moving search function and highly stiff frame.
  • The system is exchangeable among ultrasonic bonding processes, thermo-compression processes and solder processes, by a simple change-over. (Head change-over time: about 15 minutes)
    It is possible to set a variety of temperature and pressure profiles, with the unique ceramic heater and pressure control method.
  • Able to achieve the most appropriate gap with its unique head gap control function.
  • Can be used for low pressure to high pressure regions by changing over the head.

Optional functions

Ultrasonic head; ultra-low pressure head; ceramic heat stage; face up bonding; dispenser; flux; bonding inspection unit; upper communication, etc.

Specifications for FC3000S

Substrate size(mm) Ceramic heater type 3–30 mm long x 3–30 mm wide (t=0.025–1.0 mm)
Constant heater type 30–230 mm long x 30–60 mm wide (t=0.05–1.0 mm)
Substrate types Glass Epoxy, FPC, Ceramics, etc.
Chip size(mm) Thermo-compression process *1 30–20 mm long x 30–20 mm wide (t=0.05–1.0 mm)
Ultrasonic bonding process 3–15 mm long x 3–15 mm wide (t=0.05–1.0 mm)
Ultra-low pressure bonding process 3–10 mm long x 3–10 mm wide (t=0.05–1.0 mm)
Number of chip types 1-2
Chip orientation Face down
Cycle time*2*3 6.0 [sec/chip]
Alignment accuracy (3σ) *4 ±2 [μm] (X, Y)
Pressurization force [N] High-stiffness head 9.8-196
Ultra-low pressure head 0.049-9.8
Bonding head type Ultrasonic head 50kHz, 150W temperature RT, 100 [℃], 150 [℃], 180 [℃], 200 [℃]
Ceramic heater head temperature RT~450 [℃]

*1 Large-sized chip (max. 30.0 mm long x 30.0 mm wide) can be processed as an option.
*2 The time required for setting substrate is not included.
*3 Cycle time does not include processing time (i.e. loading, bonding and vacuum release time).
*4 Accuracy measurement is taken using Toray-standard substrates.