FC3000S
Flip Chip Bonder (for SiP/COC/CSP)
FC3000S
Overview
- Semi-automatic flip chip bonder.
- Able to meet needs ranging from R&D to small volume production.
- Capable of stacking application in various programs for handling 3D packaging.
- Can be used for a variety of bonding processes and devices, such as ultrasonic, flux, NCP, NCF, TSV, and Cu pillars.
Features
- Able to achieve high accuracy (±2 μm) with its moving search function and highly stiff frame.
- The system is exchangeable among ultrasonic bonding processes, thermo-compression processes and solder processes, by a simple change-over. (Head change-over time: about 15 minutes)
It is possible to set a variety of temperature and pressure profiles, with the unique ceramic heater and pressure control method. - Able to achieve the most appropriate gap with its unique head gap control function.
- Can be used for low pressure to high pressure regions by changing over the head.
Optional functions
Ultrasonic head; ultra-low pressure head; ceramic heat stage; face up bonding; dispenser; flux; bonding inspection unit; upper communication, etc.
Specifications for FC3000S
| Substrate size(mm) | Ceramic heater type | 3–30 mm long x 3–30 mm wide (t=0.025–1.0 mm) |
|---|---|---|
| Constant heater type | 30–230 mm long x 30–60 mm wide (t=0.05–1.0 mm) | |
| Substrate types | Glass Epoxy, FPC, Ceramics, etc. | |
| Chip size(mm) | Thermo-compression process *1 | 30–20 mm long x 30–20 mm wide (t=0.05–1.0 mm) |
| Ultrasonic bonding process | 3–15 mm long x 3–15 mm wide (t=0.05–1.0 mm) | |
| Ultra-low pressure bonding process | 3–10 mm long x 3–10 mm wide (t=0.05–1.0 mm) | |
| Number of chip types | 1-2 | |
| Chip orientation | Face down | |
| Cycle time*2*3 | 6.0 [sec/chip] | |
| Alignment accuracy (3σ) *4 | ±2 [μm] (X, Y) | |
| Pressurization force [N] | High-stiffness head | 9.8-196 |
| Ultra-low pressure head | 0.049-9.8 | |
| Bonding head type | Ultrasonic head | 50kHz, 150W temperature RT, 100 [℃], 150 [℃], 180 [℃], 200 [℃] |
| Ceramic heater head | temperature RT～450 [℃] | |
Notes
*1 Large-sized chip (max. 30.0 mm long x 30.0 mm wide) can be processed as an option.
*2 The time required for setting substrate is not included.
*3 Cycle time does not include processing time (i.e. loading, bonding and vacuum release time).
*4 Accuracy measurement is taken using Toray-standard substrates.