Super High Accuracy Flip Chip Bonder (for optical devices)



Super high accuracy flip chip bonders for miniature chips such as optical devices.
Fully automatic machine equipped with tray-fed chip loader, as well as substrate loading and unloading functions.


  • "Unique Ceramic Heater Head" and "Fine Substrate Stage Leveling System," wide-range profile control is available.
    In addition, it can achieve excellent surface stability.
  • Through the vibration-proof design and environment temperature auto-calibration software, stable productivity and durability are maintained.
  • By adopting an "air bearing" in the bonding head, excellent low pressure bonding operation is achieved.

Optional functions

Anti-vibration device; bonding inspection unit, etc.

Specifications for OF2000

Substrate size(mm) 2–20 mm long x 2–20 mm wide (t=0.1–1.0 mm)
Chip size(mm) 0.2–10 mm long x 0.2–10 mm wide (t=0.1–1.0 mm)
Cycle time(*1) / Cycle time 15sec/chip substrate handing 15sec
Alignment accuracy (3σ) ±0.5μm(X,Y) ±0.2°(0)(*2)
Bonding force(N) 0.049-9.8
Heat tool temperature(℃) RT-500 Ceramic heater
Stage temperature(℃) RT-500 Ceramic heater

*1 Does not include processing time (i.e. head touchdown, bonding and vacuum release).
*2 Distance between makes is 200 μm