Super High Accuracy Flip Chip Bonder (for optical devices)
Super high accuracy flip chip bonders for miniature chips such as optical devices.
Fully automatic machine equipped with tray-fed chip loader, as well as substrate loading and unloading functions.
- "Unique Ceramic Heater Head" and "Fine Substrate Stage Leveling System," wide-range profile control is available.
In addition, it can achieve excellent surface stability.
- Through the vibration-proof design and environment temperature auto-calibration software, stable productivity and durability are maintained.
- By adopting an "air bearing" in the bonding head, excellent low pressure bonding operation is achieved.
Anti-vibration device; bonding inspection unit, etc.
Specifications for OF2000
|Substrate size(mm)||2–20 mm long x 2–20 mm wide (t=0.1–1.0 mm)|
|Chip size(mm)||0.2–10 mm long x 0.2–10 mm wide (t=0.1–1.0 mm)|
|Cycle time(*1) ／ Cycle time||15sec/chip substrate handing 15sec|
|Alignment accuracy (3σ)||±0.5μm(X,Y) ±0.2°(0)(*2)|
|Heat tool temperature(℃)||RT-500 Ceramic heater|
|Stage temperature(℃)||RT-500 Ceramic heater|
*1 Does not include processing time (i.e. head touchdown, bonding and vacuum release).
*2 Distance between makes is 200 μm
- CONTACT US
Tokyo office: +81-3-5962-9773
Shiga office: +81-77-544-1892
- Technological Field
- Technology >> Encapsulation, bonding, flip chip > Flip Chip Bonders