OF2000
Super High Accuracy Flip Chip Bonder (for optical devices)
Overview
Super high accuracy flip chip bonders for miniature chips such as optical devices.
Fully automatic machine equipped with tray-fed chip loader, as well as substrate loading and unloading functions.
Features
- "Unique Ceramic Heater Head" and "Fine Substrate Stage Leveling System," wide-range profile control is available.
In addition, it can achieve excellent surface stability. - Through the vibration-proof design and environment temperature auto-calibration software, stable productivity and durability are maintained.
- By adopting an "air bearing" in the bonding head, excellent low pressure bonding operation is achieved.
Optional functions
Anti-vibration device; bonding inspection unit, etc.
Specifications for OF2000
Substrate size(mm) | 2–20 mm long x 2–20 mm wide (t=0.1–1.0 mm) |
---|---|
Chip size(mm) | 0.2–10 mm long x 0.2–10 mm wide (t=0.1–1.0 mm) |
Cycle time(*1) / Cycle time | 15sec/chip substrate handing 15sec |
Alignment accuracy (3σ) | ±0.5μm(X,Y) ±0.2°(0)(*2) |
Bonding force(N) | 0.049-9.8 |
Heat tool temperature(℃) | RT-500 Ceramic heater |
Stage temperature(℃) | RT-500 Ceramic heater |
NOTES
*1 Does not include processing time (i.e. head touchdown, bonding and vacuum release).
*2 Distance between makes is 200 μm