Laser Micro Trimming Equipment LMT Series

Pattern processing and trimming of failed chip on the glass substrate and wafer are realized by laser ablation

Laser Micro Trimming Equipment LMT-HR Series
Laser Patterning Equipment for Thin-film Multilayer Trimming
Laser Patterning Equipment "HWS series"

The laser wavelength can be changed depending on the material of the work .
The laser spot diameter can be minimized to 2μm square.
Enabled trimming of failed Mini ・Micro LED chips and wiring .
The laser spot diameter can be adjusted in the range of □2µm～□150µm .
Flexible processing depending on the failed area is possible.

Example of LED processing (Adjustable laser spot trimming ※Patented)Patented

Example

LMT Series Specification

Substrate size	~□470㎜,　~ 12 inch
Laser wavelength	1064nm / 532nm / 355nm / 266nm
Tact time	Depend on trimming specifications.
Processing precision	±2μm