Laser Micro Trimming Equipment LMT-HR Series
With our unique optical design and alignment technology, the LMT-HR Series offer best solution for the analogue memory semiconductors' fuse cutting.
Laser Micro Trimming Equipment LMT-HR Series
Made-in-Japan parts are adopted for the major parts (such as laser light source, optical system, and stage etc.) to ensure stable supply.
The size request from 4～12 inches can be accommodated.
Our unique optical design and alignment technology enabled ultra-accurate trimming accuracy. The defective wires on the semiconductor wafer can be cut and the fuses within the IC chips can be trimmed to adjust the resistance.
Example process
Example of laser processing
LMT-HR Series Specification
| Light source | DPSS Laser (Class 4) |
|---|---|
| Wavelength | 1342nm |
| Frequency | 30KHz |
| Pulse width | 20ns |
| Pulse energy | Max 10uJ/Pulse |
| Spot size | Φ2~6μm（adjustable） |
| Wafer size | 4~12inch（partially optional depending on the model） |
| Alignment Accuracy | ±0.2μm (measurement on Toray Engineering's TEG substrate) |
| Process time | ≦10min.（Φ6inch,500K shots, 300 lines） |