Laser Micro Trimming Equipment LMT-HR Series

Achieved ultra-accurate function trimming through our innovative optical designing and positioning accuracy

Made-in-Japan parts are adopted for the major parts (such as laser light source, optical system, and stage etc.) to ensure stable supply.
The size request from 4~12 inches can be accommodated.
By achieving ultra-accurate trimming through our innovative optical designing and positioning accuracy, the semiconductor wafer's failed wiring and fuses inside IC chips can be cut to adjust resistance.

Example process

Example of laser processing

LMT-HR Series Specification

Light source DPSS Laser (Class 4)
Wavelength 1342nm
Frequency 30KHz
Pulse width 20ns
Pulse energy Max 10uJ/Pulse
Spot size Φ2~6μm(adjustable)
Wafer size 4~12inch(partially optional depending on the model)
Stage resolution ±0.02μm
Process time ≦10min.(Φ6inch,500K shots, 300 lines)
  • Related terms
    • Laser processing
    • High speed processing
    • High precision processing
    • Laser trimming
    • Laser trimmer
    • Semiconductor
    • Analog semiconductor
    • Fuse


Technological Field
Technology >> Laser processing > Laser processing
Industry Sector
Industry sector >> Semiconductors > Laser Equipment for Semiconductor