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- Laser Patterning Equipment for Thin-film Multilayer Trimming
Laser Patterning Equipment for Thin-film Multilayer Trimming
Achieving selective processing by lasers to thin films multilayer
Developing a technology to selectively process only the target layer of thin films multilayer at nanometer level by our proprietary optical technology.
We achieve the process to remove only the metal layer or organic film layer without damage to the baselayer, in the field of organic thin-film solar cells, organic EL lighting etc..
Example
Specification
| Substrate size | ~ 600mm Available to a sheet substrate |
|---|---|
| Laser wavelength | 1064 nm / 532 nm / 355 nm |
| Takt time | Depend on patterning specifications. |
